The effect of different shape pattern of metal interconnects on the electrical and mechanical properties of stretchable conductive circuit
Electrically conductive adhesive (ECA) had been extensively studied to replace the Sn/Pb solder mainly found in printed circuit boards (PCBs) because of their harmful action towards human health and environment. In the production of stretchable PCBs, ECA mainly comprises of metallic filler and polymer matrix should perform good electrical and mechanical properties when straining being loaded. Therefore, determining the optimum shape pattern to be printed will contribute toward the desired traits of stretchable PCBs. In this study, commercial silver ink and thermoplastic polyurethane (TPU) as substrate was used. The ink was printed on the substrate by doctor-blade technique with different shape patterns with varies widths (1mm, 2mm and 3mm): (a) straight, (b) zigzag, (c) square and (d) sinusoidal. Then measurement of sheet resistance by four-point measurement was conducted on unloaded and loaded straining of shape pattern. This study exhibited that 3mm width zig zag shape pattern can elongate the highest straining (5% strained) compare than others patterns. In the meanwhile, straight and square shape pattern did not tolerate to any deformation which when straining at a minimum elongation of 0.1mm, the conductivity already lost. In conclusion, further study purpose, more analysis were suggested like analysis on the silver composition, curing temperature variation as well as the distribution of stress in printed shape pattern by 3D Finite Element Analysis (FEA) can be done for the more reliable study.
Abu-khalaf, J., Saraireh, R., Eisa, S., & Al-halhouli, A. (2018). Experimental Characterization of Inkjet-Printed Stretchable Circuits for Wearable Sensor Applications. Sensors, 18(10), 3476. https://doi.org/10.3390/s18103476
Dziedzic, A. (2007). Carbon/polyesterimide thick-film resistive composites – experimental determination and theoretical analysis of physicochemical , electrical and stability properties. Microelectronics Reliability, 47, 354–362.
Ghediya, P., & Chaudhuri, T. (2014). Doctor-blade printing of Cu 2 ZnSnS 4 films from microwave-processed ink Doctor-blade printing of Cu 2 ZnSnS 4 films from microwave-processed ink. Journal of Materials Science: Materials in Electronics, 23(3), 1908–1912. https://doi.org/10.1007/s10854-014-2628-1
Gonzalez, M., Axisa, F., Vanden, M., Brosteaux, D., Vandevelde, B., & Vanfleteren, J. (2008). Design of metal interconnects for stretchable electronic circuits. Microelectronics Reliability, 48, 825–832. https://doi.org/10.1016/j.microrel.2008.03.025
Hadi, P., Xu, M., Lin, C. S. K., Hui, C., & Mckay, G. (2015). Waste printed circuit board recycling techniques and product utilization. Journal of Hazardous Materials, 283, 234–243.
Hicks, W. T., Allington, T. R., & Johnson, V. (1980). Membrane Touch Switches: Thick-Film Materials Systems and Processing Options. IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 3(4), 518–524. https://doi.org/10.1109/TCHMT.1980.1135649
Ho, L., Nishikawa, H., Natsume, N., Takemoto, T., Miyake, K., & Fujita, M. (2010). Effects of Trace Elements in Copper Fillers on the Electrical Properties of Conductive Adhesives. Journal of Electronic Mater, 39(1), 115–123. https://doi.org/10.1007/s11664-009-0946-5
Hu, N., Karube, Y., Yan, C., Masuda, Z., & Fukunaga, H. (2008). Tunneling effect in a polymer/carbon nanotube nanocomposite strain sensor. Acta Materialia, 56(13), 2929–2936.
Jagt, J. C. (1998). Reliability of electrically conductive adhesive joints for surface mount applications: A summary of the state of the art. IEEE Transactions on Components Packaging and Manufacturing Technology Part A, 21(2), 215–225. https://doi.org/10.1109/95.705467
Kalavagunta, A., & Weller, R. A. (2005). Accurate geometry factor estimation for the four point probe method using comsol multiphysics. In Proceedings of the Comsol Users Conference. Boston.
Khan, S., Lorenzelli, L., & Dahiya, R. S. (2015). Technologies for printing sensors and electronics over large flexible substrates: A review. IEEE Sensors Journal, 15(6), 3164–3185. https://doi.org/10.1109/JSEN.2014.2375203
Lee, H., Chou, K., & Shih, Z. (2005). Effect of nano-sized silver particles on the resistivity of polymeric conductive adhesives. International Journal of Adhesion and Adhesives, 25, 437–441. https://doi.org/10.1016/j.ijadhadh.2004.11.008
Liang, J., Wang, Y., Huang, Y., Ma, Y., Liu, Z., & Cai, J. (2009). Electromagnetic interference shielding of graphene / epoxy composites. Carbon, 47(3), 922–925. https://doi.org/10.1016/j.carbon.2008.12.038
Lin, Y., & Chiu, S. (2004). Effects of Oxidation and Particle Shape on Critical Volume Fractions of Silver-Coated Copper Powders in Conductive Adhesives for Microelectronic Applications. Polymer Engineering and Science, 44(11), 2075–2082. https://doi.org/10.1002/pen.20212
Lin, Y., & Chiu, S. (2008). Electrical Properties of Copper-Filled Electrically Conductive Adhesives and Pressure-Dependent Conduction Behavior of Copper Particles. Journal of Adhesion Science and Technology, 22(14), 1673–1697. https://doi.org/10.1163/156856108X320537
Merilampi, S., Laine-Ma, T., & Ruuskanen, P. (2009). The characterization of electrically conductive silver ink patterns on flexible substrates. Microelectronics Reliability, 49(7), 782–790. https://doi.org/10.1016/j.microrel.2009.04.004
Poh‐Kam, W. (1995). Competing in the global electronics industry: A comparative study of the innovation networks of Singapore and Taiwan. Journal of Industry Studies, 2(2), 35–61.
Sandler, J. K. W., Kirk, J. E., Kinloch, I. A., Shaffer, M. S. P., & Windle, A. H. (2003). Ultra-low electrical percolation threshold in carbon-nanotube-epoxy composites. Polymer, 44, 5893–5899. https://doi.org/10.1016/S0032-3861(03)00539-1
Sevkat, E., Li, J., Liaw, B., & Delale, F. (2008). A statistical model of electrical resistance of carbon fiber reinforced composites under tensile loading. Composites Science and Technology, 68, 2214–2219. https://doi.org/10.1016/j.compscitech.2008.04.011
Yoon, B., Ham, D., Yarimaga, O., An, H., Lee, C. W., & Kim, J. (2011). Inkjet Printing of Conjugated Polymer Precursors on Paper Substrates for Colorimetric Sensing and Flexible Electrothermochromic Display. Advanced Materials, 23, 5492–5497. https://doi.org/10.1002/adma.201103471
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