Che Ani, F.

• Vol 12, No 1(2) (2018) - Articles
  Experimental Study of Self-Alignment during Reflow Soldering Process
  Abstract  PDF
• Vol 12, No 1(2) (2018) - Articles
  TIO2 Nanoparticles Reinforced Lead-Free 96.5Sn–3.0Ag–0.5Cu Solder Paste for Ultra-Fine Package Assembly in Reflow Soldering Process
  Abstract  PDF
• Vol 13, No 2 (2019) - Articles
  SOLDERING CHARACTERISTICS AND THERMO- MECHANICAL PROPERTIES OF Pb-FREE SOLDER PASTE FOR REFLOW SOLDERING
  Abstract  PDF