The effect of different shape pattern of metal interconnects on the electrical and mechanical properties of stretchable conductive circuit

NOR AZMMI MASRIPAN, Ghazali Omar

Abstract


Electrically conductive adhesive (ECA) had been extensively studied to replace the Sn/Pb solder mainly found in printed circuit boards (PCBs) because of their harmful action towards human health and environment. In the production of stretchable PCBs, ECA mainly comprises of metallic filler and polymer matrix should perform good electrical and mechanical properties when straining being loaded. Therefore, determining the optimum shape pattern to be printed will contribute toward the desired traits of stretchable PCBs. In this study, commercial silver ink and thermoplastic polyurethane (TPU) as substrate was used. The ink was printed on the substrate by doctor-blade technique with different shape patterns with varies widths (1mm, 2mm and 3mm): (a) straight, (b) zigzag, (c) square and (d) sinusoidal. Then measurement of sheet resistance by four-point measurement was conducted on unloaded and loaded straining of shape pattern. This study exhibited that 3mm width zig zag shape pattern can elongate the highest straining (5% strained) compare than others patterns. In the meanwhile, straight and square shape pattern did not tolerate to any deformation which when straining at a minimum elongation of 0.1mm, the conductivity already lost. In conclusion, further study purpose, more analysis were suggested like analysis on the silver composition, curing temperature variation as well as the distribution of stress in printed shape pattern by 3D Finite Element Analysis (FEA) can be done for the more reliable study.


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References


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