Experimental Study of Self-Alignment during Reflow Soldering Process
Self-alignment forces induced by solder reflow are pivotal to many relevant technologies; including precision micro-objects manipulation and chip component assembly especially in high density interconnect PCB. The primary goal of the study is to investigate the self-alignment effect of different lead-free solder experimentally during reflow soldering process. Results show that the self-alignment capability performs at its best in high silver content solder; SAC405 solder followed by SAC305 and SAC105. However the SN100C has almost similar self-alignment capabilities with the SAC305 solder even without silver trace in the SN100C solder alloy. In conclusion, the silver addition in the lead-free SnCu alloy up to 4 % silver increase surface tension of melted solder which contributed to better self-alignment performance. In the case of SN100C, the micro-alloy of Nickel traced in the SnCu alloy improved fluidity of the alloy during the self-alignment process.
J.M. Kim, Y.E. Shin, and K. Fujimoto, “Dynamic modeling for resin self-alignment mechanism,” Microelectronics Reliability, vol. 44, no. 6. pp. 983–992, 2004.
S. Gao and Y. Zhou, “Self-alignment of micro-parts using capillary interaction: Unified modeling and misalignment analysis,” Microelectronics Reliability, vol. 53, no. 8, pp. 1137–1148, 2013.
O. Krammer, “Modelling the self-alignment of passive chip components during reflow soldering,” Microelectronics Reliability, vol. 54, no. 2, pp. 457–463, 2014.
A.M. Najib, M.Z. Abdullah, A.A. Saad, Z. Samsudin, and F.C. Ani, “Numerical simulation of self-alignment of chip resistor components for different silver content during reflow soldering,” Microelectronics Reliability, vol. 79, pp. 69–78, 2017.
J. Bath, Lead-Free Soldering. New York: Springer Science Business Media, 2007.
S. Chada, “Topics in lead-free solders: Restriction of hazardous substances recast (RoHS2),” Journal of Management, vol. 65, no. 10. pp. 1348–1349, 2013.
G. Henshall, R. Healey, R.S. Pandher, S. Plainfield, K. Sweatman, K. Howell, R. Coyle, M. Hill, T. Sack, P. Snugovsky, S. Tisdale, F. Hua, and S. Clara, “iNEMI Pb-Free Alloy Alternatives Project Report: State Of The Industry,” in Proceedings Surface Mount Technology Association (SMTA) International, 2008.
R. Parker, R. Coyle, G. Henshall, J. Smetana, and E. Benedetto," iNEMI Pb-Free Alloy Characterization Project Report: Part II - Thermal Fatigue Results For Two Common Temperature Cycles" in Proceedings Surface Mount Technology Association International (SMTAI), Orlando, 2012.
G. Henshall, C. Alto, K. Sweatman, K. Howell, J.D. Tino, U.M. Miremadi, R. Parker, R. Coyle, J. Smetana, J. Nguyen, W. Liu, R. S. Pandher, D. Daily, M. Currie, T.K. Lee, J. Silk, B. Jones, S. Tisdale, F. Hua, M. Osterman, T. Sack, P. Snugovsky, A. Syed, A. Allen, J. Arnold, D. Moore, G. Chang, and E. Benedetto, “iNEMI Pb-Free Alloy Characterization Project Report: Thermal Fatigue Results For Low And No-Ag Alloys,” in 35th International Electronic Manufacturing Technology Symposium (IEMT), 2012.
K. Sweatman, K. Howell, R. Coyle, R. Parker, G. Henshall, J. Smetana, E. Benedetto, W. Lui, R. S. Pandher, D. Daily, M. Currie, J. Nguyen, T.K. Lee, M. Osterman, J. Miremadi, A. Allen, J. Arnold, D. Moore, and G. Chang, INEMI PB-Free Alloy Characterization Project Report: Part III - Thermal Fatigue Results For Low-Ag Alloys,” in Proceedings Surface Mount Technology Association International (SMTAI), Orlando, 2012.
Soldertec, Second European Lead-Free Soldering Technology Roadmap, SOLDERTEC at Tin Technology Ltd, Uxbridge, UK, 2003.
J.Y. Park, C.U. Kim, T. Carper, and V. Puligandla, “Phase equilibria studies of Sn-Ag-Cu eutectic solder using differential cooling of Sn-3.8Ag-0.7Cu alloys,” Journal of Electronic Materials, vol. 32, no. 11, pp. 1297–1302, 2003.
IPC/JEDEC, Standard for Moisture/Reflow Sensitivity Classification for Non Hermetic Solid State Surface Mount Device, JSTD-020D.1, 2008.
A.M. Najib, M.Z. Abdullah, C.Y. Khor, and A.A. Saad, “Experimental and numerical investigation of 3D gas flow temperature field in infrared heating reflow oven with circulating fan,” International Journal of Heat and Mass Transfer, vol. 87, pp. 49–58, 2015.
Stencil Design Guidelines, IPC-7525A, 2007.
Surface Mount Placement Equipment Characterization, IPC-9850A, 2002.
Placement machine manual AM100, Panasonic International, 2013.
Acceptability of Electronic Assemblies, IPC-A-610E, 2010.
J. Moser, Z., Gasior, W.,Debski,A., and Pstrus, "SURDAT-Database of Lead-Free soldering Materials," Polish Academy of Sciences Publishing, 2007.
Z. Moser, W. Gasior, A. Debski, and J. Pstrus, “SURDAT - Database of physical properties of lead-free solders,” Journal of Mining and Metallurgy, Section B: Metallurgy, vol. 43, no. 2, pp. 125–130, 2007.
T. Ventura, C.M. Gourlay, K. Nogita, T. Nishimura, M. Rappaz, and A.K. Dahle, “The influence of 0-0.1 wt.% Ni on the microstructure and fluidity length of Sn-0.7Cu-xNi,” Journal of Electronic Materials, vol. 37, no. 1, pp. 32–39, 2008.
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